The fab headlines are hard to miss. TSMC, Micron, Samsung, Intel, Texas Instruments — tens of billions of dollars each, entire new campuses going up in Arizona, Texas, Idaho, New York. Part of that push is a deadline: the tax credit tied to CHIPS Act semiconductor investment only applies to fabs that break ground before the end of 2026. So a lot of construction is happening at once, on a compressed timeline.
But the giant fabs aren’t the whole story. Every one of those facilities pulls a supply chain behind it — packaging and test houses, failure analysis labs, contract R&D shops, university cleanrooms, component qualification benches, and PCB manufacturers building the boards that eventually house these chips. Those are smaller operations, and they’re being stood up or expanded right alongside the fabs themselves. That’s where source capture has a real role to play.
Fab Exhaust and Bench Exhaust are Different Problems
A 300mm wafer fab runs dedicated abatement systems for its process gases — arsine, phosphine, hydrogen fluoride, and other chemistries that call for specialized scrubbing on a scale of their own. That’s not the space we’re in.
What shows up more often around these projects is smaller and more familiar: wet chemistry stations, dicing and prep benches, soldering and rework stations, failure analysis setups where a technician is working directly over a process that’s putting particulate or solvent vapor into the air close to their face. That’s a point-source capture problem — the kind of thing a properly sized extraction arm and filtration stack is built for, with an extraction arm positioned close enough to actually capture what it’s aimed at, a blower with enough CFM to hold capture velocity at that distance, and a filtration stack — HEPA, ULPA, activated carbon, or some combination — matched to what’s actually in the air.
PCB manufacturing and assembly is one of the more concrete examples. Wave soldering and reflow ovens both drive off flux fumes, and manual rework and touch-up stations put a technician’s face directly over a hot iron and flux vapor for hours at a time. On the bare-board fabrication side, etching and stripping processes bring their own chemical fume profile. None of it calls for fab-scale gas abatement — it calls for the same kind of point-source capture used at any solder or chemical bench, sized to the specific station and process.

Equipping the Bench with Extract-All
As more failure analysis labs, test houses, and R&D benches get built out alongside the bigger fab projects, the ventilation question is worth answering early — before a facility layout is finalized and a workstation ends up without proper capture.
Whether you need the flexibility of a portable fume extractor, the dedicated power of a stationary unit, or the added safety of an explosion-proof model, the right solution depends on your specific processes, workstation layout, and contamination levels. Extract-All offers a full range of industrial fume extractors built to handle demanding environments and keep workers protected, and our team is available to help you find the right fit for a semiconductor-adjacent lab or bench. Contact us to get started.

Fume Extractors
Extract-All® Fume Extraction systems offer the most versatile, user-friendly design capable of capturing harmful fumes, dust, vapors, and smoke from a wide range of industrial applications. All of our mobile & portable fume extractors can accommodate a variety of filter media, including HEPA, ULPA, Medical Grade Filter Media, and a variety of adsorbent chemical filter media such as Activated Carbon. With multi-stage filtration and source-capture options our industrial fume extractors are designed to remove airborne contaminants before they reach the operator’s breathing zone, ensuring safer and cleaner air. Our fume extraction systems are designed to handle demanding industrial environments.

Source Capture at the Bench: What Semiconductor R&D and Test Labs Actually Need